High Precision Txhuas Stainless Hlau SPHC SPCC Sheet Hlau Stamping Part

Cov kauj ruam hauv qab no feem ntau suav nrog hauv cov txheej txheem oxidation:
1. Raw khoom noj: Siv cov kav dej los muab cov khoom siv raw rau lub reactor kom tswj tau qhov sib npaug ntawm cov khoom raw hauv.
2. Cov tshuaj tiv thaiv: Txhawm rau ua tiav cov tshuaj tiv thaiv oxidation, ntxiv cov pa oxygen rau lub reactor thiab tswj cov tshuaj tiv thaiv kab mob (xws li kub, siab, thiab lub sijhawm tshuaj tiv thaiv).
3. Kev sib cais ntawm cov khoom: Siv lub tshuab cua txias kom txias cov khoom reacted, tig nws los ntawm lub xeev gaseous mus rau hauv cov kua los yog cov khoom, thiab ces siv ib tug cais cais cov khoom los ntawm ntau yam khoom.
4. Purification: Kom paub meej tias cov khoom siv tshuaj tiv thaiv mus txog qhov tsim nyog purity, purify nws.

5. Ntim: Tom qab cov khoom tiav lawm, lawv tau ntim raws li cov lus qhia thiab cov qauv ua ntej yuav muag rau cov neeg siv khoom lossis xa mus rau theem tom ntej ntawm kev ua haujlwm.
Hauv qee cov ntawv tshwj xeeb, xws li semiconductor wafer fabrication, cov txheej txheem oxidation ntxiv nrog rau kev siv lub zog hluav taws xob thiab oxidants (xws li cov pa thiab dej) mus rau silicon substrate thiaj li tsim tau cov silicon dioxide (SiO2) txheej. Cov oxide zaj duab xis no ua haujlwm los tiv thaiv etching txheej los tiv thaiv lub wafer los ntawm kev tsis pom kev etching thaum lub sij hawm etching txheej txheem, nres diffusion thaum lub sij hawm ion implantation txheej txheem, thiab nres tam sim no los ntawm kev hla circuits.