Stamp aluminium ntawv hlau qhov chaw

Cov txheej txheem oxidation

Cov kauj ruam hauv qab no feem ntau suav nrog hauv cov txheej txheem oxidation:

1. Raw material feeding: Siv cov kav dej los muab cov khoom siv raw rau lub reactor kom tswj tau qhov sib npaug ntawm cov khoom raw hauv.
2. Cov tshuaj tiv thaiv: Txhawm rau ua tiav cov tshuaj tiv thaiv oxidation, ntxiv cov pa oxygen rau lub reactor thiab tswj cov tshuaj tiv thaiv kab mob (xws li kub, siab, thiab lub sijhawm tshuaj tiv thaiv).
3. Kev sib cais ntawm cov khoom: Siv lub tshuab cua txias kom txias cov khoom reacted, tig nws los ntawm lub xeev gaseous mus rau hauv cov kua los yog cov khoom, thiab ces siv ib tug cais cais cov khoom los ntawm ntau yam khoom.
4. Purification: Kom paub meej tias cov khoom siv tshuaj tiv thaiv mus txog qhov tsim nyog purity, purify nws.
5. Ntim: Tom qab cov khoom tiav lawm, lawv tau ntim raws li cov lus qhia thiab cov qauv ua ntej yuav muag rau cov neeg siv khoom lossis xa mus rau theem tom ntej ntawm kev ua haujlwm.

Hauv qee qhov kev siv tshwj xeeb, xws li semiconductor wafer ua, cov txheej txheem oxidation kuj tseem muab cov oxidants (xws li dej, oxygen) thiab thermal zog ntawm silicon substrate los ua silicon dioxide (SiO2) zaj duab xis.Cov oxide zaj duab xis no tiv thaiv cov wafer los ntawm kev tiv thaiv kom tsis txhob ntws tawm ntawm cov circuits, tiv thaiv kev sib kis thaum lub sij hawm ion implantation txheej txheem, thiab ua raws li ib tug anti-etching zaj duab xis uas tiv thaiv kev ua yuam kev etching thaum lub sij hawm etching txheej txheem.